NTAG 424 DNA (NT4H2421Gx) sets a new standard for secure NFC and IoT applications. It features AES-128 cryptography and a Secure Unique NFC (SUN) message function, which generates unique authentication data with each read by an NFC-enabled mobile device. This ensures advanced protection for products and content, offering secure and exclusive user experiences in real time.
NTAG 424 DNA complies with the NFC Forum Type 4 Tag IC specification, using a contactless protocol and an ISO/IEC file system for maximum interoperability in the NFC infrastructure. It supports excellent user interaction and reading distances up to 10 cm.
Using AES-128, the tag generates a SUN message for authentication every time it is tapped. An NFC mobile device reads this unique URL with the SUN message, sends it to the host for authentication, and returns the verification result. The SUN authentication works on Android and iOS 11, providing tag authentication and ensuring data authenticity, integrity, and confidentiality.
The chip has a file-based memory structure of 416 bytes, including a Capability Container (CC) file to specify NFC operations, an NDEF file, and an extra data file for sensitive content protection. Configurable access rights support various use cases for manufacturers and service providers. With 5 customer-defined AES keys, NTAG 424 DNA enables advanced cryptographic functions for secure access.
NTAG 424 DNA also offers configurable features like optional encryption of part of the NDEF file and fully encrypted communication for privacy-sensitive applications. An optional Random ID, along with encrypted chip data, ensures compliance with data protection regulations.
In addition to standard AES-128, NTAG 424 DNA can provide an alternative AES-based protocol for secure messaging, enhancing resistance to side-channel attacks.
With a high input capacitance of 50 pF, the NTAG 424 DNA chip is suitable for smart product applications requiring small antennas, without sacrificing performance. Smaller NFC tags can easily be integrated into product labels, modules, caps, and other packaging formats.